PARSIPPANY, N.J—  Sun Chemical has launched a new SunLam solvent-free ultra-low monomer  adhesive, designed for packaging producers seeking high-performance applications that offer a sustainable alternative to solvent-based adhesives.  Officially titled SunLam QA-8000+HA450, the new adhesive is part of Sun Chemical’s proprietary ULM technology. The adhesive extends its capabilities to meet the needs of flexible packaging manufacturers producing high-end applications such as extended boiling-pasteurisation, hot-filling, low-retort packaging and products that require improved chemical resistance in acidic or alcoholic environments. Engineered for high-performance applications, the new product helps reduce energy consumption and CO2 emissions, as its VOC-free formulation has no drying requirements on a laminator. It supports lightweighting and facilitates mechanical recyclability for mono-material packaging thanks to a lower coating weight compared to solvent-based technology. It offers easy processing and fast bond strength development, and it features a high level of thermal resistance and lay-down on printed substrates.